3M™ Thermally Conductive Acrylic Interface Pad 5571N-0.5, White, 300 mm x 20 m x 0,5 mm, 4 Rolls/Case
- 3M ID 7100097880
- UPC 08806080063698
Dettagli
Caratteristiche principali
- High thermal conductivity, 2.0 W/m-K on plane direction
- Good softness and conformability even to non-flat IC surfaces and heat spreading blocks
- Passes UL 94 V-2 flame retardance test
- No siloxane outgassing or oil bleeding
- Soft compliant material allows for pressure relaxation, preventing high pressure zones on components
- Good electrical insulation properties
- Slight tack allows easy pre-assembly
- Good wetting performance for better thermal conductivity
3M™ Thermally Conductive Acrylic Interface Pad 5571N is 0.5 mm thick and designated to provide a preferential heat transfer path between heat generating components like integrated circuit chip and heat spreaders as aluminum heat sink.
3M™ Thermally Conductive Acrylic Interface Pad 5571N has a medium-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Our family of 3M™ Thermally Conductive Acrylic Interface Pads provide low-outgassing and high-performance solutions compared to silicone. These acrylic pads have no siloxane VOC or oil bleeding, which are associated with silicone products and can often cause device failure. They are lightweight, making them ideal for applications with finer spacing requirements and a small footprint. 3M™ Thermally Conductive Acrylic Interface Pads have good electrical insulation properties to protect against electrical interference and device breakdown.
Recommended Applications:
Heat transfer between PCB and heat sink
Decrease of compression stress to electronic parts by thermal pad softness
Gap filling in electronic devices
Chip on film (COF) heat dissipation
Power electronic component thermal management
Examples:
LED displays
Electric vehicle (EV) batteries
Wireless charging units
Satellite navigation
Sensors
Process control equipment
Test & measurement devices
Specifiche tecniche
